CFD Analysis of Perforated Heat Sink Fins

Authors

  • Ashish Ranjan P.G. Student, Dept. of Mechanical Engineering, Radharaman Institute of Research and Technology, Bhopal, M.P., India
  • Vishal Gupta Associate Professor, Department of Mechanical Engineering, , Radharaman Group of Institution, Bhopal, M.P., India

Keywords:

Temperature, Perforation, Heat Sink, perforation, compact heat removal

Abstract

Recently the need for high performance and compact size electronic device is rising exponentially. With the reduction in size and increase in the number of task performed by these device the need for better and compact heat removal device is also increasing. Various researchers are researching in the field to provide an efficient heat removal device which has high efficiency and is compact in size. Electrical and mechanical goes in series with each other. In this study the objective was to analyze Heat sink fin with different perforation shapes. Heat sinks are used as a cooling device in various applications and fields. In this study various heat sink model were designed with varying perforation shapes in order to increase contact area. As it is a proven fact larger the contact area better will be the cooling. This was kept in mind while designing the hollow perforated fins for the analysis..

References

Rıdvan YAKUT, Kenan YAKUT, Faruk YEŞİLDAL, Altuğ KARABEY,(2016) Experimental and Numerical Investigations of Impingement Air Jet for a Heat Sink, IX International Conference on Computational Heat and Mass Transfer, ICCHMT2016

Hetsroni, G., Mosyak, A. and Segal, Z., (2001), “Non-uniform temperature distribution in electronic devices cooled by flow in parallel microchannels”, IEEE Transactions on Components and Packaging Technologies, Vol. 24, pp. 16-23.

Hetsroni, G., Mosyak, A., Segal, Z. and Pogrebnyak, E., (2003), “Two-phase flow patterns in parallel microchannels”, International Journal of Multiphase Flow, Vol. 11, pp. 353-358.

Bau, H.H., (1998), “Optimization of conduits’ shape in micro heat exchangers”, International Journal of Heat and Mass Transfer, Vol. 41, pp. 2717-2723.

Culham, J.R., Yovanovich, M.M. and Lemczyk, T.F., (2000), “Thermal characterization of electronic packages using a three-dimensional fourier series solution”, ASME Journal of Electronic Packaging, Vol. 122, pp. 233-239.

Davies, M.R.D., Cole, R. and Lohan, J., (2000), “Factors affecting the operational thermal resistance of electronic components”, ASME Journal of Electronic Packaging, Vol. 122, pp. 185-191.

Downloads

Published

31-03-2017

How to Cite

Ashish Ranjan, & Vishal Gupta. (2017). CFD Analysis of Perforated Heat Sink Fins. International Journal for Research Publication and Seminar, 8(1), 53–64. Retrieved from https://jrps.shodhsagar.com/index.php/j/article/view/980

Issue

Vol. 8 No. 1 (2017): Jan - Mar 2017

Section

Original Research Article

License

Copyright (c) 2017 International Journal for Research Publication and Seminar

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.

Re-users must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use. This license allows for redistribution, commercial and non-commercial, as long as the original work is properly credited.