Aravind Sundeep, (Dr.) Punit Goel, A Renuka. Evaluating Power Delivery and Thermal Management in High-Density PCB Designs. JRPS [Internet]. 2023 Dec. 29 [cited 2024 Sep. 22];14(5):240-52. Available from: https://jrps.shodhsagar.com/index.php/j/article/view/1480