ARAVIND SUNDEEP; (DR.) PUNIT GOEL; A RENUKA. Evaluating Power Delivery and Thermal Management in High-Density PCB Designs. International Journal for Research Publication and Seminar, [S. l.], v. 14, n. 5, p. 240–252, 2023. DOI: 10.36676/jrps.v14.i5.1480. Disponível em: https://jrps.shodhsagar.com/index.php/j/article/view/1480. Acesso em: 24 nov. 2024.