CFD ANALYSIS OF PERFORATED FINS

Authors

  • Neeraj Yadav P.G. Student, Dept. of Mechanical Engineering, R K.D.F. College of Technology, Bhopal, M.P., India1
  • Rajneesh Kumar Gedam Associate Professor, Dept. of Mechanical Engineering, , R K.D.F. College of Technology, Bhopal, M.P., India

Keywords:

Perforation, Temperature, Heat Sink, Fins

Abstract

Recently the need for high performance and compact size electronic device is rising exponentially. With the reduction in size and increase in the number of task performed by these devices the need for better and compact heat removal device is also increasing. Various researchers are researching in the field to provide an efficient heat removal device which has high efficiency and is compact in size. Electrical and mechanical goes in series with each other. In this study the objective was to analyze Heat sink fin with different perforation shapes. Heat sinks are used as a cooling device in various applications and fields.
In this study various heat sink model were designed with varying perforation shapes in order to increase contact area. As it is a proven fact larger the contact area better will be the cooling. This was kept in mind while designing the hollow perforated fins for the analysis..

References

Hetsroni, G., Mosyak, A. and Segal, Z., (2001), “Non-uniform temperature distribution in electronic devices cooled by flow in parallel microchannels”, IEEE Transactions on Components and Packaging Technologies, Vol. 24, pp. 16-23.

Bau, H.H., (1998), “Optimization of conduits’ shape in micro heat exchangers”, International Journal of Heat and Mass Transfer, Vol. 41, pp. 2717-2723.

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Published

31-03-2017

How to Cite

Neeraj Yadav, & Rajneesh Kumar Gedam. (2017). CFD ANALYSIS OF PERFORATED FINS. International Journal for Research Publication and Seminar, 8(1), 65–75. Retrieved from https://jrps.shodhsagar.com/index.php/j/article/view/984

Issue

Vol. 8 No. 1 (2017): Jan - Mar 2017

Section

Original Research Article

License

Copyright (c) 2017 International Journal for Research Publication and Seminar

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