FIN EFFICIENCY ANALYSIS IN ELECTRONIC DEVICES CONSIDERING TEMPERATURE, HEAT TRANSFER COEFFICIENT, FIN LENGTH: A REVIEW

Authors

  • Deepika Nain Research Scholar,Department of ECE, BPSMV, Khanpur Kalan
  • Mr. Mittarpal Co-supervisor, Department of ECE, BPSMV, Khanpur Kalan

Keywords:

Heat Transfer, Coefficient, Fin Length, Surface Roughness, Offset Strip Fins

Abstract

Temperature, Heat Transfer, Coefficient, Fin Length are considered in the
research work to review the Fin Efficiency in Electronic Devices. There are several
researches related to the fin efficiency in which some of them have been listed in this
work. In this research work, simulation of fin array is done by using MATLAB GUI
system. Results for increasing and decreasing of various factors are calculated.
Comparative analysis has been proposed related to cases when heat transfer, length and
temperature are varied. The present work would be able to optimize the problem related
to natural convection heat transfer. The variation related to effectiveness with respect to
base temperature. There would be decrement in the effectiveness related to rectangular and triangular at the time of
the increment of base temperature. The rectangular fin would exhibit with more effectiveness.

References

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Published

31-12-2019

How to Cite

Deepika Nain, & Mr. Mittarpal. (2019). FIN EFFICIENCY ANALYSIS IN ELECTRONIC DEVICES CONSIDERING TEMPERATURE, HEAT TRANSFER COEFFICIENT, FIN LENGTH: A REVIEW. International Journal for Research Publication and Seminar, 10(4), 15–23. Retrieved from https://jrps.shodhsagar.com/index.php/j/article/view/1283

Issue

Vol. 10 No. 4 (2019): october-december

Section

Original Research Article

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